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  • 238000005530 etching Methods 0.000 claims abstract description 22.
  • 239000000126 substance Substances 0.000 claims abstract description 28.
  • 238000004519 manufacturing process Methods 0.000 title abstract description 13.
  • 238000000034 method Methods 0.000 title abstract description 34.
  • 239000004065 semiconductor Substances 0.000 title claims abstract description 39.
  • Assignors: EAST WEST BANK Status Active legal-status Critical Current Adjusted expiration legal-status Critical Links Assigned to APPLIED OPTOELECTRONICS INC reassignment APPLIED OPTOELECTRONICS INC RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Publication of US20150243558A1 publication Critical patent/US20150243558A1/en Application granted granted Critical Publication of US9356422B2 publication Critical patent/US9356422B2/en Assigned to BRANCH BANKING AND TRUST COMPANY reassignment BRANCH BANKING AND TRUST COMPANY SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).

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    Assignors: ANSELM, KLAUS ALEXANDER, BIKKY, RAJESH, PICKRELL, GREG, HU, STEPHEN, SULTANA, NAHID, UM, JAE YOON, WONG, CHIA CHEN DAVID Assigned to EAST WEST BANK reassignment EAST WEST BANK SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). reassignment APPLIED OPTOELECTRONICS, INC. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) Filing date Publication date Application filed by Applied Optoelectronics Inc filed Critical Applied Optoelectronics Inc Priority to US14/190,765 priority Critical patent/US9356422B2/en Assigned to APPLIED OPTOELECTRONICS, INC. Original Assignee Applied Optoelectronics Inc Priority date (The priority date is an assumption and is not a legal conclusion.

    groove scribe download

    Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.) ( en Inventor Klaus Alexander Anselm Rajesh Bikky Stephen Hu Greg Pickrell Nahid Sultana Jae Yoon Um Chia Chen David Wong Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Active, expires Application number US14/190,765 Other versions US20150243558A1

    GROOVE SCRIBE DOWNLOAD PDF

    Google Patents Scribe etch process for semiconductor laser chip manufacturingĭownload PDF Info Publication number US9356422B2 US9356422B2 US14/190,765 US201414190765A US9356422B2 US 9356422 B2 US9356422 B2 US 9356422B2 US 201414190765 A US201414190765 A US 201414190765A US 9356422 B2 US9356422 B2 US 9356422B2 Authority US United States Prior art keywords wafer mask layer trench scribe line window Prior art date Legal status (The legal status is an assumption and is not a legal conclusion. Google Patents US9356422B2 - Scribe etch process for semiconductor laser chip manufacturing US9356422B2 - Scribe etch process for semiconductor laser chip manufacturing









    Groove scribe download